Integrated electronic device with edge-termination structure and manufacturing method thereof

ABSTRACT

An embodiment of an integrated electronic device formed in a semiconductor body delimited by a lateral surface, which includes: a substrate made of a first semiconductor material; a first epitaxial region made of a second semiconductor material, which overlies the substrate and defines a first surface; a second epitaxial region made of a third semiconductor material, which overlies the first surface and is in contact with the first epitaxial region, the third semiconductor material having a bandgap narrower than the bandgap of the second semiconductor material; an active area, extending within the second epitaxial region and housing at least one elementary electronic component; and an edge structure, arranged between the active area and the lateral surface, and including a dielectric region arranged laterally with respect to the second epitaxial region, which overlies the first surface and is in contact with the first epitaxial region.

RELATED APPLICATION DATA

This application is related to the U.S. patent application Ser. No. ______ entitled VERTICAL-CONDUCTION INTEGRATED ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THEREOF, (Attorney Docket No.: 2110-505-03) filed ______, and application Ser. No. ______ entitled INTEGRATED ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THEREOF, (Attorney Docket No.: 2110-506-03) filed ______ and which are incorporated herein by reference in their entireties.

PRIORITY CLAIM

The instant application claims priority to Italian Patent Application No. TO2010A000724, filed Aug. 30, 2010, which application is incorporated herein by reference in its entirety.

TECHNICAL FIELD

An embodiment relates to an integrated electronic device having an edge-termination structure and to a manufacturing method thereof.

BACKGROUND

As is known, integrated electronic devices are formed within dies, which are manufactured starting from wafers of semiconductor material and have, in plan view, a generally rectangular or square shape.

In detail, the edges and corners of the dies correspond to the so-called “scribe lines”, i.e., to the lines along which the wafers of semiconductor material are cut to form the dies themselves. In other words, the scribe lines define corresponding lateral surfaces of the dies.

In greater detail, each integrated electronic device can include a plurality of elementary electronic components, such as, for example, transistors, diodes, photodiodes, etc. Furthermore, given a generic die that houses at least one elementary electronic component, within the die it is possible to define a peripheral region (also known as “edge region”), adjacent to the scribe lines, and a central region, which is surrounded by the peripheral region and in which the at least one elementary electronic component is physically made. In addition, in the peripheral region there is usually provided a so-called edge-termination structure.

As is known, the edge-termination structures surround corresponding active areas, i.e., areas set within the central regions and housing the elementary electronic components. In use, the edge-termination structures perform the function of preventing onset of breakdown phenomena within the peripheral regions, which are more subject to the phenomenon of breakdown as compared to the central regions. In fact, the active areas, and hence the central regions, are typically designed so that the elementary electronic components housed therein can sustain (in theory) a maximum voltage V_(max), before the breakdown of the PN junctions present within said elementary electronic components occurs. Instead, within the edge regions, it is possible for breakdown to occur also at voltages much lower than the maximum voltage V_(max), with consequent limitation of the voltage that can effectively be applied to the elementary electronic components, and hence also to the integrated electronic device that houses them. In particular, the peripheral regions are more subject to the phenomenon of breakdown on account of the presence, in general, of corners and/or curvatures of doped regions, with consequent possibility, in use, of an increased density of the equipotential lines, i.e., an increase of the electrical field, to the point of causing breakdown of the semiconductor material that forms the peripheral regions.

For practical purposes, the edge-termination structures hence perform the function of reducing locally the intensity of the electrical field so as to prevent peaks of intensity of the electrical field in the proximity of the edges.

The presence of appropriate edge-termination structures is even more important in the case of integrated electronic devices formed at least in part not only of silicon but also of silicon carbide (SiC). In fact, within said integrated electronic devices very intense electrical fields are generated, which, in the central regions, are typically confined within portions made of silicon carbide, which has a critical electrical field higher than the critical electrical field of silicon. Instead, in the absence of appropriate edge-termination structures, it is possible, in the peripheral regions, for intense electrical fields to be generated also within silicon portions, with the consequent possibility of a breakdown occurring.

SUMMARY

An embodiment is an integrated electronic device and a manufacturing method that enable the drawbacks of the known art to be overcome at least in part.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the concepts disclosed herein, embodiments are now described, purely by way of non-limiting example and with reference to the annexed drawings, wherein:

FIGS. 1-5 show cross sections of different embodiments of the present integrated electronic device; and

FIGS. 6-20 show cross sections of embodiments of the present integrated electronic device during successive manufacturing steps.

DETAILED DESCRIPTION

FIG. 1 shows an embodiment of the present integrated electronic device 1, which is a vertical-conduction electronic device and forms a trench MOSFET 2.

In detail, the trench MOSFET 2 is formed in a die 3, in which it is possible to define a peripheral region 3 a, adjacent to a scribe line LT, and a central region 3 b, where the trench MOSFET 2 is physically made.

The die 3 includes a body 4 of semiconductor material, which includes, in turn, a substrate 5 of silicon carbide, of an N++ type (for example, doped with nitrogen), which has a bottom surface S₅; the silicon carbide can be of any polytype (4H, 6H, 3C, etc.). Furthermore, the body 4 includes a buffer layer 6, of an N+ type, as well as a bottom epitaxial layer 8 and an intermediate epitaxial layer 10 of an N and N+ type, respectively.

In detail, the buffer layer 6 is set on top of the substrate 5, with which it is in direct contact. The bottom epitaxial layer 8 is set on top of and in direct contact with the buffer layer 6. Moreover, the intermediate epitaxial layer 10 is set on top of and in direct contact with the bottom epitaxial layer 8.

The substrate 5 has a thickness h₅ that may be, for example, approximately between 100 μm and 600 μm, and moreover has a doping level that can be, for example, approximately between 1·10¹⁸ cm⁻³ and 1·10¹⁹ cm⁻³.

The buffer layer 6 has a thickness h₆ that can, for example, be approximately 0.5 μm, and moreover has a doping level that can, for example, be approximately 1·10¹⁸ cm⁻³.

The bottom epitaxial layer 8 has a thickness h₈ that can, for example, be approximately 9 μm, and moreover has a doping level that can, for example, be approximately 1·10¹⁵ cm⁻³.

As regards, instead, the intermediate epitaxial layer 10, it is optional and has a thickness h₁₀ that can, for example, be approximately 0.2 μm, and moreover has a doping level that can be, for example, between 5·10¹⁵ cm⁻³ and 5·10¹⁶ cm⁻³. Furthermore, the intermediate epitaxial layer 10 defines an intermediate surface S₁₀ and performs the function of reducing the output resistance of the trench MOSFET 2.

The body 4 further includes a top epitaxial layer 12, which is made of silicon and is of a P type (for example, doped with boron). In detail, the top epitaxial layer 12 defines a top surface S₁₂ and extends over the intermediate surface S₁₀, in direct contact with the intermediate epitaxial layer 10. Furthermore, the top epitaxial layer 12 has a thickness h₁₂ that can be, for example, in the range approximately between 1 μm and 2 μm. In addition, the top epitaxial layer 12 has a doping level that can be, for example, in the range approximately between 1·10¹⁷ cm⁻³ and 5·10¹⁷ cm⁻³. As will emerge clearly hereinafter, in said embodiment the top epitaxial layer 12 functions as a body region.

In practice, the body 4 of semiconductor material is delimited at the top and at the bottom by the top surface S₁₂ and by the bottom surface S₅, respectively. Furthermore, the body 4 is delimited laterally by the scribe line LT, which defines a lateral surface of the body 4.

The trench MOSFET 2 further includes a first semiconductor region 14 a and a second semiconductor region 14 b, which are of a P+ type, extend underneath the intermediate surface S₁₀, and function, respectively, as a first deep body region and as a second deep body region.

In detail, the first and second semiconductor regions 14 a, 14 b are arranged laterally at a distance apart so as to define an internal region 16 set between them. Furthermore, the first semiconductor region 14 a is arranged between the second semiconductor region 14 b and the scribe line LT.

In greater detail, the first and second semiconductor regions 14 a, 14 b extend, starting from the intermediate surface S₁₀, with a depth h₁₄ greater than the thickness h₁₀, but less than h₈+h₁₀. In other words, the first and second semiconductor regions 14 a, 14 b traverse the intermediate epitaxial layer 10 completely and extend partially within the bottom epitaxial layer 8. Furthermore, the first and second semiconductor regions 14 a, 14 b have an average doping level N_(a) _(—) ₁₄ such that:

h ₁₄>2·ε·E _(c)/(q·N _(a) _(—) ₁₄)  (1)

where ε is the absolute permittivity of silicon carbide, E_(c) is the critical electrical field of silicon carbide, and q is the electron charge. For example, the thickness h₁₄ can be approximately 0.4 μm, and the average doping level N_(a) _(—) ₁₄ can be in the range approximately between 1·10¹⁸ cm⁻³ and 5·10¹⁸ cm⁻³.

The trench MOSFET 2 further includes a trench 20, which extends from the top surface S₁₂ and has a thickness h₂₀>h₁₂+h₁₀. In other words, the trench 20 extends through the top epitaxial layer 12 and the intermediate epitaxial layer 10 until it contacts the bottom epitaxial layer 8.

Furthermore, the trench 20 is arranged at a distance apart laterally with respect to the first and second semiconductor regions 14 a, 14 b so as to extend within the internal region 16 without contacting the first and second semiconductor regions 14 a, 14 b, which are approximately equidistant from the trench 20 itself.

In detail, the trench 20 is delimited by a wall 22, and the first and second semiconductor regions 14 a, 14 b are both at approximately a distance d from the wall 22. In practice, if we designate by w₂₀ the width of the trench 20 and by w₁₆ the width of the internal region 16, we have w₁₆≈w₂₀+2d.

The wall 22 is coated internally with a first oxide layer 24. Furthermore, present within the trench 20 is a first gate region 26, which is in direct contact with the first oxide layer 24 and is made of polysilicon.

The trench MOSFET 2 further includes a first dielectric area 30, which is arranged on the top surface S₁₂, is vertically aligned with the trench 20, and is in direct contact with the first oxide layer 24 and with the first gate region 26.

The trench MOSFET 2 further includes a source region 32 of an N+ type (for example, doped with phosphorus or arsenic) and with a doping level of approximately 10¹⁹ cm⁻³. In detail, the source region 32 extends from the top surface S₁₂ and surrounds the trench 20. In addition, the source region 32 contacts the first oxide layer 24 and the first dielectric area 30. In greater detail, the source region 32 includes a first source subregion 32 a and a second source subregion 32 b, which extend on opposite sides with respect to the trench 20.

The integrated electronic device 1 further includes a top metallization 34 and a bottom metallization 36, as well as a gate metallization (not shown), the latter contacting the first gate region 26 in a way in itself known.

In detail, the top metallization 34 functions as source metallization and extends on the top surface S₁₂, in direct contact with the top epitaxial layer 12, so as to surround the first dielectric area 30. Furthermore, the source metallization 34 is in direct contact with the source region 32.

The bottom metallization 36 functions as drain metallization and extends underneath the bottom surface S₅ of the substrate 5, with which it is in direct contact.

Within the peripheral region 3 a it is possible to distinguish an edge area E, arranged within the body 4 and housing an edge-termination structure, described hereinafter. Furthermore, within the central region 3 b it is possible to distinguish an active area A, arranged within the body 4 and housing the trench MOSFET 2.

In particular, the active area A extends through the top epitaxial layer 12, the intermediate epitaxial layer 10, and part of the bottom epitaxial layer 8, and is partially delimited by the first and second semiconductor regions 14 a, 14 b.

In greater detail, the active area A houses a junction of the metal-oxide-semiconductor type formed by the first gate region 26, by the first oxide layer 24, and by the top epitaxial layer 12.

By biasing in a way in itself known the top metallization 34 and the gate metallization, it is possible to form a channel of an N type within the top epitaxial layer 12, and in particular in a region of the top epitaxial layer 12 arranged in direct contact with the first oxide layer 24. Furthermore, by biasing in a way in itself known the top metallization 34 and the bottom metallization 36 with a voltage V_(DS), it is possible to generate a current I_(DS).

The current I_(DS) flows between the top metallization 34 and the bottom metallization 36; hence, it has a vertical direction and flows both through the silicon and through the silicon carbide. In particular, the current I_(DS) flows within the N channel, traversing the top epitaxial layer 12. In addition, the current I_(DS) traverses the substrate 5, the buffer layer 6, as well as the bottom epitaxial layer 8 and the intermediate epitaxial layer 10.

In practice, the substrate 5, the buffer layer 6, and the bottom epitaxial layer 8 function as drain region of the trench MOSFET 2, the body region of which is formed by the top epitaxial layer 12, as mentioned previously.

In the case where the voltage V_(DS) is such as to reversely bias the PN junction present between the top epitaxial layer 12 and the intermediate epitaxial layer 10, and hence also the PN junction present between the bottom epitaxial layer 8 and the first and second semiconductor regions 14 a, 14 b, the magnitude of the voltage V_(DS) cannot exceed a maximum voltage V_(max); otherwise, a phenomenon of breakdown is triggered within the trench MOSFET 2.

In particular, the maximum voltage V_(max) is particularly high thanks to the presence, within the intermediate epitaxial layer 10 and part of the bottom epitaxial layer 8, of the first and second semiconductor regions 14 a, 14 b.

In fact, assuming for reasons of simplicity that the source region 32 and the first gate region 26 are short-circuited, the thickness h₁₄ and the doping of the first and second semiconductor regions 14 a, 14 b are such that the voltage V_(DS) falls substantially within the first and second semiconductor regions 14 a, 14 b, as well as within the bottom epitaxial layer 8 and the buffer layer 6. In other words, a significant nonzero electrical field is generated only within the first and second semiconductor regions 14 a, 14 b, the bottom epitaxial layer 8, and the buffer layer 6; instead, within the top epitaxial layer 12, the electrical field is to a first approximation negligible. Consequently, the maximum voltage V_(max) is limited at the top, instead of by the critical electrical field of silicon, by the critical electrical field of silicon carbide, which, as has been said, is higher than the critical electrical field of silicon.

In greater detail, as regards the top epitaxial layer 12, the electrical field present therein is negligible not only in the proximity of the first and second semiconductor regions 14 a, 14 b, but also in the proximity of the internal region 16, i.e., where the top epitaxial layer 12 is not in direct contact with the first and second semiconductor regions 14 a, 14 b.

In fact, as illustrated qualitatively in FIG. 1, underneath the first and second semiconductor regions 14 a, 14 b, the equipotential lines L that are generated within the trench MOSFET 2 are approximately parallel to the first and second semiconductor regions 14 a, 14 b. Instead, in the internal region 16, the equipotential lines L bend, on account of the presence of the trench 20, and in particular of the first oxide layer 24, in such a way that the electrical field itself assumes a direction to a first approximation parallel to the intermediate surface S₁₀.

From a more quantitative standpoint, in order to reduce the electrical field present in the portions of top epitaxial layer 12 arranged facing the internal region 16, it is possible to impose d<h₈.

The integrated electronic device 1 further includes a first dielectric region 40, which extends above the intermediate surface S₁₀, in direct contact with the intermediate epitaxial layer 10 and with a thickness h₄₀, which, as illustrated in the embodiment of FIG. 1, can be approximately equal to the thickness h₁₂.

In detail, the first dielectric region 40 can be made, for example, of silicon oxide, or else silicon nitride, or else a combination of silicon oxide and silicon nitride. Furthermore, the first dielectric region 40 extends above the intermediate surface S₁₀ so as to be coplanar with respect to the top epitaxial layer 12, by which it is surrounded. In other words, the first dielectric region 40 defines a first portion 12 a and a second portion 12 b of the top epitaxial layer 12, which are arranged laterally at a distance apart and between which the first dielectric region 40 extends. In practice, the active area A extends in the second portion 12 b, whilst the first portion 12 a is delimited by the scribe line LT in such a way that the first dielectric region 40 is arranged between the active area A and the scribe line LT, i.e., between the active area A and the lateral surface of the body 4.

In greater detail, the first dielectric region 40 is laterally staggered and is partially arranged on top of the first semiconductor region 14 a, with which it is in direct contact. In particular, the first dielectric region 40 is arranged on top of the first semiconductor region 14 a for a width x, for example, in the range approximately between 0.5 μm and 5 μm.

Extending on top of the first dielectric region 40 is a second dielectric region 42 made, for example, of borophosphosilicate glass (BPSG). In particular, the second dielectric region 42 is in direct contact with the first dielectric region 40 and extends laterally so as to overlie partially also the first and second portions 12 a, 12 b of the top epitaxial layer 12, with which it is in direct contact. In turn, the second dielectric region 42 is overlaid in part by the top metallization 34, with which it is in direct contact. Furthermore, the top metallization 34 is arranged between the first dielectric area 30 and the second dielectric region 42.

The integrated electronic device 1 further includes an equipotential ring (EQR) 50 made of metal material, which extends on the top surface S₁₂ and is coupled to the bottom metallization 36 through the first portion 12 a of the top epitaxial layer 12. Consequently, the equipotential ring 50 is, in use, at the same potential as the bottom metallization 36, but for the voltage drop due to the built-in voltage that sets up between the first portion 12 a and the intermediate epitaxial layer 10.

In greater detail, the equipotential ring 50 partially overlies the second dielectric region 42, with which it is in direct contact, and contacts the first portion 12 a of the top epitaxial layer 12, being, instead, separate from the top metallization 34.

In practice, the first dielectric region 40 forms a partially buried edge-termination structure such that, in use, the equipotential lines L assume the pattern illustrated qualitatively in FIG. 1. In particular, in the first dielectric region 40, the equipotential lines L are inclined with respect to the intermediate surface S₁₀ and to the top surface S₁₂ so as to traverse said first dielectric region 40. The electrical field thus remains confined within the first dielectric region 40, without penetrating within the first and second portions 12 a, 12 b of the top epitaxial layer 12. Consequently, onset of the phenomenon of breakdown within the top epitaxial layer 12 is prevented, even in the peripheral region 3 a of the die 3.

As regards the second dielectric region 42, this bestows strength on the edge-termination structure and functions as a protective element in regard to possible external contaminating agents.

As regards, instead, the first portion 12 a of the top epitaxial layer 12, this could be absent; i.e., the first dielectric region 40 could extend up to the scribe line LT; however, its presence prevents the presence of a large thickness of dielectric material at the scribe line LT.

As illustrated in FIG. 2, according to a different embodiment, the first dielectric region 40 defines a first protuberance 52 and a second protuberance 53, arranged on respective edges of the first dielectric region 40, raised with respect to the top surface S₁₂ and surrounded by the second dielectric region 42.

As illustrated in FIG. 3, according to yet a further embodiment, the first dielectric region 40 is partially arranged on top of the second portion 12 b of the top epitaxial layer 12 in such a way that the first protuberance 52 extends over the top surface S₁₂. The second protuberance 53, instead, is absent.

In said embodiment, the second dielectric region 42 extends so as to surround the protuberance 52 in order to prevent contact between the first dielectric region 40 and the top metallization 34. Furthermore, the first dielectric region 40 does not contact the first portion 12 a of the top epitaxial layer 12. In other words, between the first dielectric region 40 and the first portion 12 a a first gap 54 is present, extending within which is the equipotential ring 50. In use, unlike what is illustrated in FIG. 1, the equipotential ring 50 is at the same potential as the bottom metallization 36, without any voltage drop occurring due to the built-in voltage that sets up between the first portion 12 a and the intermediate epitaxial layer 10.

As illustrated in FIG. 4, according to a different embodiment, the integrated electronic device 1 is of the type illustrated in FIG. 1 and further includes a confinement region 60 of a P− type (for example, doped with aluminium), which extends through the intermediate epitaxial layer 10, starting from the intermediate surface S₁₀, with a thickness h₆₀ approximately equal, for example, to the thickness h₁₄ of the first and second semiconductor regions 14 a, 14 b.

In greater detail, the confinement region 60 has a doping level at least approximately equal to the doping level of the bottom epitaxial layer 8, and lower than the doping level of the first and second semiconductor regions 14 a, 14 b. Furthermore, the confinement region 60 extends between the first semiconductor region 14 a, with which it is in direct contact, and the scribe line LT, and is entirely overlaid by the first dielectric region 40, with which it is in direct contact. In addition, the confinement region 60 extends at a distance from the scribe line LT. Once again, as illustrated in the embodiment of FIG. 4, the confinement region 60 can be staggered laterally with respect to the equipotential ring 50 in such a way that the equipotential ring 50 does not overlap the confinement region 60.

In practice, if we designate by 62 a region of curvature of the first semiconductor region 14 a having approximately the shape of a corner and delimiting a portion of the first semiconductor region 14 a facing the scribe line LT, the confinement region 60 enables reduction of the electrical field, which, in the absence of the confinement region 60, would be localized in the region of curvature 62.

Even though they are not shown, likewise possible are embodiments of the type illustrated in FIGS. 2 and 3, and moreover provided with the confinement region 60 described previously. Furthermore, within the active area A, the integrated electronic device 1 can form, instead of the trench MOSFET 2, a different elementary electronic component, such as for example a junction diode, a power MOS transistor, an insulated-gate bipolar transistor (IGBT), etc. Purely by way of example, FIG. 5 shows an embodiment in which the integrated electronic device 1 forms, within the active area A, a planar-cell MOSFET 70.

In particular, with reference to FIG. 5, elements present therein and already present in FIG. 1 are designated by the same reference numbers. Furthermore, the ensuing description is limited to the differences with respect to the embodiment illustrated in FIG. 1.

In detail, the top epitaxial layer 12 is of an N− type (for example, doped with phosphorus) and has a doping level for example of approximately 10¹⁵ cm⁻³. Furthermore, extending within the active area A are a first top region 72 a and a second top region 72 b of a P type (for example, doped with boron), which function, respectively, as first and second body regions.

In detail, the first and second top regions 72 a, 72 b have a doping level comprised, for example, approximately between 5·10¹⁶ cm⁻³ and 5·10¹⁷ cm⁻³. Furthermore, the first and second top regions 72 a, 72 b are arranged laterally at a distance apart and are arranged, respectively, underneath and in direct contact with the first and second source subregions 32 a, 32 b. In practice, the first source subregion 32 a is arranged between the first dielectric region 40, from which it is laterally spaced apart, and the second source subregion 32 b.

In greater detail, the first and second top regions 72 a, 72 b surround, respectively, the first and second source subregions 32 a, 32 b, and extend vertically through the top epitaxial layer 12 starting from the top surface S₁₂, until they contact the first and second semiconductor regions 14 a, 14 b, respectively.

Extending on the top surface S₁₂ is a second oxide layer 74. In particular, the second oxide layer 74 extends on top of and in direct contact with a portion of the top epitaxial layer 12 arranged between the first and second source subregions 32 a, 32 b, which are overlaid in part by said second oxide layer 74.

Extending on top of and in direct contact with the second oxide layer 74 is a second gate region 76, made of polysilicon and overlaid, in turn, by a second dielectric area 78. In particular, the second dielectric area 78 surrounds both the second oxide layer 74 and the second gate region 76, and moreover contacts the first and second source subregions 32 a, 32 b.

Extending moreover on the top surface S₁₂ is a third oxide layer 84, which extends, in particular, on top of and in direct contact with a portion of the top epitaxial layer 12 arranged between the first top region 72 a and the first dielectric region 40. Furthermore, both the first top region 72 a and the first dielectric region 40 are in part overlaid by the third oxide layer 84, with which they are in direct contact.

Extending on top of and in direct contact with the third oxide layer 84 is a third gate region 86, made of polysilicon and overlaid in part by a third dielectric area 88.

In detail, the third gate region 86 is coupled, in a way in itself known and consequently not illustrated, to the second gate region 76. Furthermore, the third dielectric area 88 is laterally spaced apart from the second dielectric region 42 so as to define a second gap 90, extending within which is a gate metallization 92 of the planar-cell MOSFET 70. The gate metallization 92 overlaps the second dielectric region 42, and the third dielectric area 88 contacts the third gate region 86 and is decoupled from the top metallization 34.

In turn, the top metallization 34 surrounds the second dielectric area 78 and is decoupled from the third oxide layer 84 and from the third gate region 86 thanks to the interposition of the third dielectric area 88. In practice, the top metallization 34 functions as source metallization, whilst the bottom metallization 36 functions as drain metallization.

An embodiment of the present integrated electronic device can be obtained using the manufacturing method described in what follows and represented in FIGS. 6-20. By way of example, and without this implying any loss of generality, described in what follows are the operations regarding manufacture of the embodiments illustrated in FIGS. 1, 2, 3 and 4. In particular, with regard to the embodiment illustrated in FIG. 4, the corresponding manufacturing process functions as an example, in general, for obtaining the embodiments provided with the confinement region 60.

As illustrated in FIG. 6, to obtain the embodiment illustrated in FIG. 1, the substrate 5 is provided, and then the buffer layer 6, the bottom epitaxial layer 8, and the intermediate epitaxial layer 10 are formed. In particular, also the buffer layer 6 can be formed by means of epitaxial growth.

Next (FIG. 7), using a first mask 100 made of an appropriate material, for example, silicon oxide or silicon nitride deposited with chemical-vapor-deposition (CVD) techniques, a sequence of implants of dopant species of a P type (for example, aluminium atoms) is executed (represented by the arrows 102) so as to localize the dopant species in a first thin layer 14 a′ and a second thin layer 14 b′ of a P+ type, which are arranged underneath the intermediate surface S₁₀ and are to form, respectively, the first and second semiconductor regions 14 a, 14 b.

In particular, the sequence of implants is formed by one or more successive implants, obtained using the same first mask 100. In greater detail, each implant of the sequence of implants is executed with a hot process, i.e., at a temperature higher than approximately 400° C. in order to limit the defects introduced during the implant itself within the crystalline lattice of the silicon carbide. In addition, each implant can be made at a dosage of approximately between 1·10¹⁵ cm⁻² and 1·10¹⁶ cm⁻² and within an energy range of approximately between 20 keV and 200 keV.

Next (FIG. 8), the first mask 100 is removed, and an annealing is performed at a temperature of approximately between 1400° C. and 1850° C. and of a duration of approximately between 10 and 100 minutes, in order to reduce the sites of the bottom epitaxial layer 8 and of the intermediate epitaxial layer 10 damaged following upon the previous ion-implantation process, as well as to activate the dopant species. In practice, the annealing is carried out at a temperature sufficient to activate an appropriate amount of dopant in such a way that the first and second thin layers 14 a′, 14 b′ form, respectively, the first and second semiconductor regions 14 a, 14 b.

Next (FIG. 9), the top epitaxial silicon layer 12 is formed by heteroepitaxy.

Next (FIG. 10), using a second resist mask 104, a (dry or wet) chemical etch is performed for selective removal of a portion of the top epitaxial layer 12, thus defining a first window 106 and the first and second portions 12 a, 12 b of the top epitaxial layer 12. In particular, the first window 106 is arranged between the first and second portions 12 a, 12 b, and is to house the first dielectric region 40. In greater detail, the chemical etch has as an end-point the silicon carbide in such a way that, in an area corresponding to the first window 106, the silicon is removed almost entirely to entirely.

Next (FIG. 11), the second resist mask 104 is removed, and a first dielectric layer 40′ is deposited, which is to form the first dielectric region 40. The first dielectric layer has a thickness sufficient to fill the first window 106 entirely; hence, it has a thickness greater than the thickness h₁₂, and can be formed in turn by a plurality of dielectric substrates (not shown).

Next (FIG. 12), a chemical mechanical polishing (CMP) is performed in order to remove portions of the first dielectric layer 40′ arranged on the outside of the first window 106, thus forming the first dielectric region 40.

In a way in itself known and hence not illustrated, there are then formed the source region 32, the trench 20, the first oxide layer 24, the first gate region 26, the first dielectric region 30, and the second dielectric region 42, as well as the top metallization 34, the gate metallization, and the bottom metallization 36. Finally, in a way in itself known, a position of the scribe line LT is determined, and the die 3 is cut, to obtain the integrated electronic device illustrated in FIG. 1. In what follows, for reasons of brevity, said aforementioned operations (not illustrated in detail) are referred to as “final operations”.

With regard to the embodiment illustrated in FIG. 2, to obtain it according to an embodiment the operations illustrated in FIGS. 6-9 are performed, and subsequently (FIG. 13) an (optional) buffer oxide layer 110 and a silicon-nitride layer 112 are formed on the top surface S₁₂. In particular, the buffer oxide layer 110 performs the function of limiting the mechanical stresses introduced into the top epitaxial layer 12 during the operations described hereinafter.

Next (FIG. 14), by using a third resist mask 120, a chemical etch is performed for selective removal of a portion of the silicon-nitride layer 112 to define a second window 126 that is to house the first dielectric region 40, as described hereinafter.

Next (FIG. 15), a further chemical etch is performed, self-aligned with the previous chemical etch, i.e., obtained using the third resist mask 120, and having the aim of selectively removing a portion of the buffer oxide layer 110 (if present) and a portion of the top epitaxial layer 12, both of which underlie the second window 126. In practice, by so doing, the second window 126 increases in thickness.

At the end of the further chemical etch, the second window 126 extends within the top epitaxial layer 12 with a thickness h₁₂₆ (calculated starting from the top surface S₁₂) at most equal to approximately h₁₂−h₄₀/2, in such a way that the window 126 does not reach the underlying silicon carbide; for example, in the case where h₄₀=h₁₂, the thickness h₁₂₆ can be approximately half of the thickness h₁₂ of the top epitaxial layer 12. Consequently, underneath the second window 126, the top epitaxial layer 12 defines a residual portion 12 c of silicon.

Next (FIG. 16), the entire residual portion 12 c is thermally oxidized, thus forming the first dielectric region 40, which, on account of the greater volume of the silicon oxide with respect to the silicon, likewise forms the first and second protuberances 52, 53. In this way, the first dielectric region 40 is in direct contact with the intermediate surface S₁₀ defined by the intermediate epitaxial layer 10. The silicon-nitride layer 112 and the buffer oxide layer 110 (if it is present) are then removed, and finally the aforementioned final operations are performed.

As regards, instead, the embodiment illustrated in FIG. 3, to obtain it the operations illustrated in FIGS. 6-11 are performed, and subsequently (FIG. 17) a chemical etch is carried out using a fourth resist mask 140. In particular, the fourth resist mask 140 is set, with respect to the second resist mask 104 used previously, in such a way that the first dielectric region 40 defines the first gap 54 and the first protuberance 52, which extends over the top surface S₁₂.

Next, the fourth resist mask 140 is removed, and the aforementioned final operations are performed.

Finally, as regards the embodiment illustrated in FIG. 4, to obtain it the operations illustrated in FIGS. 6 and 7 are performed.

Next (FIG. 18), hence before carrying out annealing at a temperature of approximately between 1400° C. and 1850° C., an implantation of dopant species of a P type (for example, aluminium), represented by the arrows 152, is performed by means of a fifth mask 150 so as to localize the dopant species in a third thin layer 60′ of a P− type, which is arranged underneath the intermediate surface S₁₀, in contact with the first thin layer 14 a′, and is to form the confinement region 60. In greater detail, the fifth mask 150 can be formed starting from the first mask 100, by means of selective removal of a portion of said first mask 100. Furthermore, said implant can be made with a dosage comprised in the range approximately between 1·10¹² cm⁻² and −5·10¹³ cm⁻² and with an energy in the range approximately between 20 keV and 200 keV, as well as at a temperature of approximately 400° C. In particular, the dosage is such that no appreciable alteration of the doping level of the first and second thin layers 14 a′, 14 b′ occurs.

Next (FIG. 19), the fifth mask 150 is removed, and annealing is performed at a temperature of approximately between 1400° C. and 1850° C. in such a way that the first, second, and third thin layers 14 a′, 14 b′ and 60′ form, respectively, the first semiconductor region 14 a, the second semiconductor region 14 b, and the confinement region 60.

Next, the operations illustrated in FIGS. 9-12 and the final operations are performed.

Alternatively, once again to obtain the embodiment illustrated in FIG. 4, it is possible to perform the operations illustrated in FIGS. 6-8, and subsequently (FIG. 20), hence after having removed the first mask 100 and having performed annealing at a temperature of approximately between 1400° C. and 1850° C., to execute, by means of a sixth mask 160, an implantation of dopant species of a P type (for example, boron). Said implant, represented by the arrows 162, performs the function of forming the aforementioned third thin layer 60′.

In greater detail, said implant can be made at approximately room temperature, with a dosage comprised in the range approximately between 5·10¹⁴ cm⁻² and 5·10¹⁵ cm⁻² and with an energy in the range approximately between 20 keV and 200 keV. Furthermore, the sixth mask 160 is set, with respect to the first mask 100 used previously, so as to enable implantation of dopant species also in a portion of the first semiconductor region 14 a facing the third thin layer 60′. In this way, any possible misalignment between the sixth mask 160 and the first mask 100 is avoided so that the third thin layer 60′ does come into contact with the first semiconductor region 14 a.

Next, the operations illustrated in FIGS. 9-12 and the final operations are performed.

In practice, according to the latter embodiment, the confinement region 60 coincides with the third thin layer 60′; hence, formation of this confinement region 60 does not involve any annealing. Consequently, the confinement region 60 has a high degree of defectiveness, which enables further reduction of the electrical field in the proximity of the region of curvature 62.

Advantages that embodiments of the present integrated electronic device and the present manufacturing method afford emerge clearly from the foregoing discussion.

In detail, an embodiment of the present integrated electronic device resorts to a buried edge-termination structure, which enables prevention of generation of appreciable electrical fields within the top epitaxial layer 12, also in the proximity of the scribe line LT. In particular, an embodiment of the present integrated electronic device is less subject, as compared to traditional devices, to the onset of the phenomenon of breakdown, also in conditions of inhibition, i.e., when the top metallization 34 and the bottom metallization 36 are biased in such a way that the PN junction present between the top epitaxial layer 12 and the intermediate epitaxial layer 10 is reversely biased.

Finally, it is evident that modifications and variations may be made to embodiments of the present integrated electronic device and manufacturing method, without thereby departing from the scope of the present disclosure.

Purely by way of example, it is possible to reverse all the types of the semiconductor elements described, and/or use different semiconductor materials, for example using germanium instead of silicon, or else, once again by way of example, using germanium instead of silicon and silicon instead of silicon carbide. Furthermore, the semiconductor material which forms the substrate 5 can be chosen in a way independent of the semiconductor materials that form the buffer layer 6, the bottom epitaxial layer 8, the intermediate epitaxial layer 10 (if it is present), and the top epitaxial layer 12.

Furthermore, with regard to an embodiment of the manufacturing method, it is for example possible that the operations illustrated in FIG. 15 are such that the second window 126 does not extend within the top epitaxial layer 12; i.e., they are such that h₁₂₆=0. The residual portion 12 c hence has a thickness equal to the entire thickness h₁₂ of the top epitaxial layer 12, and consequently the first dielectric region 40, which is generated following upon the process of thermal oxidation of the entire residual portion 12 c, has a thickness h₄₀ greater than the thickness h₁₂.

Moreover, an embodiment of the above-described electronic device may form part of an integrated circuit, which may be combined with one or more other integrated circuits on a same or on different dies to form a system. At least one of the integrated circuits may include a controller such as a processor.

From the foregoing it will be appreciated that, although specific embodiments have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and scope of the disclosure. Furthermore, where an alternative is disclosed for a particular embodiment, this alternative may also apply to other embodiments even if not specifically stated. 

1. A semiconductor structure, comprising: a first semiconductor layer having a first bandgap; a second semiconductor layer disposed over the first layer and having a second bandgap that is narrower than the first bandgap; a device region disposed in the second semiconductor layer; an edge region disposed in the second semiconductor layer remote from the device region; and an insulator region disposed over the first semiconductor layer between the device and edge regions.
 2. The semiconductor structure of claim 1 wherein: the first layer includes a first epitaxial layer; and the second layer includes a second epitaxial layer.
 3. The semiconductor structure of claim 1 wherein: the first semiconductor layer includes silicon carbide; and the second semiconductor layer includes silicon.
 4. The semiconductor structure of claim 1 wherein: the second semiconductor layer includes an opening between the device and edge regions; and the insulator region is disposed in the opening.
 5. The semiconductor structure of claim 1 wherein the device region includes a transistor region.
 6. The semiconductor structure of claim 1 wherein the device region includes a transistor-body region.
 7. The semiconductor structure of claim 1 wherein the insulator region is disposed over the edge region.
 8. The semiconductor structure of claim 1 wherein the insulator region is disposed over the device region.
 9. The semiconductor structure of claim 1, further including a third semiconductor layer disposed between the first and second layers and having approximately the first bandgap.
 10. The semiconductor structure of claim 1, further including: a substrate semiconductor layer disposed beneath the first layer and having approximately the first bandgap; and a buffer semiconductor layer disposed between the substrate layer and the first layer and having approximately the first bandgap.
 11. The semiconductor structure of claim 1, further including: a substrate semiconductor layer disposed beneath the first layer and having approximately the first bandgap; and a conductor coupled to the edge region of the second layer and to the substrate layer.
 12. The semiconductor structure of claim 1, further including: a substrate semiconductor layer disposed beneath the first layer and having approximately the first bandgap; wherein the second semiconductor layer includes an opening between the insulator region and the edge region; and a conductor disposed in the opening and coupled to the edge region, the first semiconductor layer, and the substrate layer.
 13. The semiconductor structure of claim 1, further including: wherein the device and edge regions have a first conductivity; and a region of the first semiconductor layer disposed beneath the device and edge regions and having a second conductivity.
 14. The semiconductor structure of claim 1, further including: wherein the device region has a first conductivity; and a region disposed in the first layer beneath the device and insulator regions and having the first conductivity.
 15. The semiconductor structure of claim 1, further including: wherein the device region has a first conductivity; wherein the first layer includes a region having a second conductivity; and a region disposed in the region of the first layer beneath the insulator region and remote from the device region and having the first conductivity.
 16. The semiconductor structure of claim 1 wherein the device region includes: a first portion having a first conductivity; and a second portion having a second conductivity.
 17. An integrated circuit, comprising: a semiconductor structure, including: a first semiconductor layer having a first bandgap; a second semiconductor layer disposed over the first layer and having a second bandgap that is narrower than the first bandgap; a device region disposed in the second semiconductor layer; an edge region disposed in the second semiconductor layer remote from the device region; and an insulator region disposed over the first semiconductor layer between the device and edge regions.
 18. A system, comprising: a first integrated circuit, including: a semiconductor structure, including: a first semiconductor layer having a first bandgap; a second semiconductor layer disposed over the first layer and having a second bandgap that is narrower than the first bandgap; a device region disposed in the second semiconductor layer; an edge region disposed in the second semiconductor layer remote from the device region; and an insulator region disposed over the first semiconductor layer between the device and edge regions; and a second integrated circuit coupled to the first integrated circuit.
 19. The system of claim 18 wherein the first and second integrated circuits are disposed on a same die.
 20. The system of claim 18 wherein the first and second integrated circuits are disposed on respective dies.
 21. The system of claim 18 wherein one of the first and second integrated circuits includes a controller.
 22. A method, comprising: generating a voltage across a semiconductor structure having a first semiconductor layer having a first bandgap, a second semiconductor layer disposed over the first layer and having a second bandgap that is narrower than the first bandgap, a device region disposed in the second semiconductor layer, an edge region disposed in the second semiconductor layer remote from the device region, and an insulator region disposed over the first semiconductor layer between the device and edge regions; causing a first portion of the voltage to be across the first semiconductor layer; and causing a second portion of the voltage to be across the device region, the second portion less than the first portion.
 23. The method of claim 22 wherein the second portion of the voltage is approximately zero volts.
 24. The method of claim 22, further including causing a third portion of the voltage to be across the edge region, the third portion less than the first portion.
 25. The method of claim 22, further including causing a third portion of the voltage to be across the insulator region, the third portion greater than the second portion.
 26. An integrated electronic device formed in a body of semiconductor material delimited laterally by a lateral surface, said device comprising: a substrate of a first semiconductor material; a first epitaxial region of a second semiconductor material, which overlies the substrate and defines a first surface; a second epitaxial region of a third semiconductor material, which overlies the first surface and is in direct contact with the first epitaxial region, the third semiconductor material having a bandgap narrower than the bandgap of the second semiconductor material; an active area extending within the second epitaxial region and housing at least one elementary electronic component; and an edge-termination structure, arranged between the active area and the lateral surface, and comprising a first dielectric region arranged laterally with respect to the second epitaxial region, which overlies the first surface and is in direct contact with the first epitaxial region.
 27. The electronic device according to claim 26, wherein the first epitaxial region is of a first type of conductivity, and further comprising a deep region of a second type of conductivity, extending underneath the first surface and within the first epitaxial region, the first dielectric region being partially arranged on top of the deep region, with which it is in direct contact.
 28. The electronic device according to claim 27, wherein the edge-termination structure further comprises a confinement region having the second type of conductivity, extending within the first epitaxial region starting from the first surface, the confinement region being arranged laterally with respect to the deep region, with which it is in direct contact, and being moreover overlaid, in direct contact, by the first dielectric region.
 29. The electronic device according to claim 28, wherein the confinement region has a doping level lower than the doping level of the deep region.
 30. The electronic device according to claim 26, further comprising a third epitaxial region of the third semiconductor material, which overlies the first surface and is in direct contact with the first epitaxial region, the first dielectric region being arranged between the second epitaxial region and the third epitaxial region.
 31. The electronic device according to claim 30, wherein the third epitaxial region is laterally spaced apart from the first dielectric region in such a way that the first dielectric region and the third epitaxial region delimit a gap, the electronic device further comprising a conductive region extending within the gap and in direct contact with the first epitaxial region.
 32. The electronic device according to claim 26, further comprising a second dielectric region, which overlies the first dielectric region.
 33. A method for manufacturing an integrated electronic device, comprising the steps of: providing a substrate of a first semiconductor material; forming on top of the substrate a first epitaxial region of a second semiconductor material, defining a first surface; forming, on top of and in direct contact with the first epitaxial region, a second epitaxial region of a third semiconductor material (Si), the third semiconductor material having a bandgap narrower than the bandgap of the second semiconductor material; forming, within an active area extending within the second epitaxial region, at least one elementary electronic component; defining a position of a scribe line with respect to the active area; and forming, on top of the first surface and in direct contact with the first epitaxial region, and laterally with respect to the second epitaxial region, a first dielectric region, arranged between the active area and the position of the scribe line.
 34. The manufacturing method according to claim 33, wherein the step of forming a second epitaxial region comprises forming a first epitaxial layer on top of the first epitaxial region, and wherein the step of forming the first dielectric region comprises the steps of: selectively removing a portion of the first epitaxial layer so as to form a first window, which traverses the first epitaxial layer throughout the thickness; and forming a first dielectric layer on top of the first epitaxial layer and within the first window.
 35. The manufacturing method according to claim 34, wherein the step of forming the first dielectric region further comprises the step of carrying out a chemical mechanical polishing for removing portions of the first dielectric layer arranged on the outside of the first window.
 36. The manufacturing method according to claim 34, wherein the step of forming the first dielectric region further comprises the step of carrying out a masked chemical etch for removing portions of the first dielectric layer arranged on the outside of the first window.
 37. The manufacturing method according to claim 33, wherein the step of forming a second epitaxial region comprises forming a first epitaxial layer on top of the first epitaxial region, and wherein the step of forming the first dielectric region comprises the step of completely oxidizing a residual portion of the first epitaxial layer.
 38. The manufacturing method according to claim 33, wherein the first epitaxial region is of a first type of conductivity, and further comprising executing, after the step of forming a first epitaxial region and before the step of forming a second epitaxial region, the step of forming, underneath the first surface and within the first epitaxial region, a deep region having a second type of conductivity, the step of forming a first dielectric region comprising providing the first dielectric region so that it is in direct contact with and partially arranged on top of the deep region.
 39. The manufacturing method according to claim 38, further comprising the step of forming, within the first epitaxial region and starting from the first surface, a confinement region having the second type of conductivity, arranged laterally and in direct contact with the deep region, and overlaid, in direct contact, by the first dielectric region.
 40. The manufacturing method according to claim 39, wherein the step of forming a deep region comprises carrying out a first implant of dopant species of the second type of conductivity, and wherein the step of forming a confinement region comprises carrying out, after performing the first implant, a second implant of dopant species of the second type of conductivity, the method further comprising the step of carrying out an annealing at a temperature higher than 1400° C., said step of carrying out an annealing being executed alternatively between the first implant and the second implant or else after the second implant. 